QCi Roadmap
Building the future of quantum for everyone
Our vision: bringing quantum into the hands of people
We are leading the forthcoming technology revolution by combining quantum science, nonlinear nanophotonics, and scalable photonics manufacturing to deliver room-temperature, chip-integrated, drop-in compatible quantum hardware.
Our mission is simple and bold:
We are making quantum technology practical, accessible, and available to everyone.
Capture. Compute. Communicate. These three core capabilities define our platforms and products, enabling practical, scalable , real-world deployment of quantum solutions.
We are evolving from a technology innovator into a full-scale manufacturer capable of delivering quantum-enabled systems at industrial scale. Through our innovations in quantum computing, sensing, communications, and photonic-AI, we are moving quantum out of the laboratory and into homes, businesses, government agencies, and critical infrastructure, where it can make an immediate impact.
What sets us apart
Quantum optics & integrated photonics foundation. We are combining quantum optics and integrated photonics to build components, devices, systems, and turn-key solutions that operate at room-temperature, with low power requirements and practical form factors. This foundation enables affordable and deployable quantum hardware.
Room-temperature quantum performance. Unlike many quantum technologies that require cryogenic cooling, our photonic architecture is delivering quantum functionality at room-temperature. This dramatically reduces system complexity, cost, and power requirements, enabling practical deployment in real-world environments and accelerating adoption across commercial and industrial markets.
Manufacturing built for scale. In 2025, we completed our Quantum Photonic Chip Foundry (Fab 1) in Tempe, Arizona. This facility is capable of producing thin-film lithium niobate (TFLN) photonic chips and puts us in a strong position to scale fabrication, meet demand, and support broad deployment.
Commercial traction across markets. We are seeing strong market validation, including a steady year-over-year revenue increase and our first U.S. commercial deployment of quantum security solutions with a top-five U.S. bank.
Strategic partnerships and government collaboration. We are working closely with government agencies and strategic partners, including an ongoing project with NASA, to apply quantum optimization to real-world challenges like satellite-based LiDAR data processing, demonstrating the utility of quantum systems beyond research environments. These efforts demonstrate the practical value of quantum systems beyond research environments.
Manufacturing built for scale
From innovation to production
Fab 1: Laying the Foundations
We are building the world’s first scalable quantum photonics supply chain. With Fab 1 now operational in Tempe, AZ, we are one of the only companies that can vertically integrate thin-film lithium niobate (TFLN) photonic chip manufacturing with quantum-focused device engineering and packaged hardware systems. This infrastructure is the foundation of our next decade of growth.
Fab 1 Capabilities:
Producing TFLN photonic chips for initial commercial components
Delivering early hardware systems, including quantum optimization units, photonic-AI modules, random number generators and early quantum sensors
Supporting enterprise, financial, government and research sectors
Expanding engineering and manufacturing capacity to support early commercialization
Fab 2: The Future of Quantum Photonics Manufacturing
Fab 2 will expand our production capacity from specialty fabrication to scalable volume manufacturing, enabling widespread deployment of quantum-powered hardware across telecom, defense, data centers, space, advanced AI systems and consumer applications.
Fab 2 Capabilities:
Producing 10,000+ wafers annually, with expansion capabilities
Supporting integration with III-V devices
Delivering photonic integrated circuit (PIC) modules for room-temperature quantum hardware
Maintaining compliance with ISO 9001, ITAR, DoD and CE standards
Performing fully automated testing, screening, and reliability validation
Operating a stable, domestic and allied-shore supply chain for TFLN wafers
Fab 2 is where quantum manufacturing becomes scalable, repeatable, and accessible.
2024-2026
During this phase, we are establishing the core technology and manufacturing infrastructure required to bring quantum photonics into real-world environments, enabling room-temperature, chip-integrated, drop-in compatible quantum hardware.
Laying the foundations and first products
Completing and commissioning Fab 1 for TFLN photonic chips in Tempe, AZ.
Launching our first commercial TFLN based photonic components.
Delivering initial hardware systems, including quantum optimization units, photonic-AI modules, random-number generators, and early quantum sensors.
Introducing products across enterprise, financial, government, and research sectors.
Expanding engineering and manufacturing capacity to support early commercialization.
Completing the design and engineering for Fab 2 to support volume production.
2024-2026
During this phase, we are establishing the core technology and manufacturing infrastructure required to bring quantum photonics into real-world environments, enabling room-temperature, chip-integrated, drop-in compatible quantum hardware.
2027–2029
During this phase, we are scaling from early manufacturing to industrial-grade production while broadening our hardware offerings and enabling practical deployment across commercial, industrial, and consumer applications.
Scaling manufacturing & product lines
Building and commissioning Fab 2 for volume photonic chip manufacturing.
Expanding our product portfolio to include:
Advanced photonic-AI accelerators
Next-generation quantum sensors
Secure quantum communication systems
Room-temperature, chip-integrated, quantum processing units
Building global go-to-market infrastructure, including automated packaging, testing, supply-chain readiness, and customer deployment workflows.
Expanding commercial relationships across high-performance compute, tele/datacom, defense, government, and space sectors.
2027–2029
During this phase, we are scaling from early manufacturing to industrial-grade production while broadening our hardware offerings and enabling practical deployment across commercial, industrial, and consumer applications.
2030–2032
By this stage, we are evolving into a full-scale manufacturer, delivering quantum-enabled systems globally and supporting repeatable, volume deployment of our chip-integrated quantum hardware.
Global deployment & volume manufacturing
Fab 2 reaches full commercial output.
Supporting reliable, volume deployment of chip-integrated quantum hardware worldwide.
Integrating quantum systems into high-performance compute, tele/datacom, and defense sectors.
Enabling broad adoption of room-temperature quantum devices for consumer, enterprise, and government markets.
2030–2032
By this stage, we are evolving into a full-scale manufacturer, delivering quantum-enabled systems globally and supporting repeatable, volume deployment of our chip-integrated quantum hardware.
2033 and beyond
By this stage, we are enabling a world where room-temperature, chip-integrated, drop-in compatible quantum hardware is part of daily life from homes and businesses to government, critical infrastructure, and industrial applications.
Quantum for everyone
Quantum hardware is widely available and embedded in everyday technology.
Quantum-enabled high-performance computing, sensing, and secure communications becoming mainstream across global markets.
Expanding global leadership in quantum photonics manufacturing and resilient supply chains.
Delivering on our vision by making quantum technology practical, accessible, and transformative for all.
2033 and beyond
By this stage, we are enabling a world where room-temperature, chip-integrated, drop-in compatible quantum hardware is part of daily life from homes and businesses to government, critical infrastructure, and industrial applications.
Guiding principles
Practicality First:
We are designing room-temperature, robust, and deployable solutions for quantum hardware built for real-world use.
Scalable by Design:
Manufacturability is central to our roadmap. Every device is engineered to be fabricated, packaged, and deployed at scale.
Accessible to All:
Our mission is to move quantum out of the lab and into the hands of people everywhere.
Innovation with Purpose:
We are focusing on real-world needs including AI acceleration, secure communication, sensing, and computing that solve pressing global challenges.
The road ahead
We are building more than quantum hardware. We are building the infrastructure for the forthcoming technology revolution.
From today’s photonic devices to tomorrow’s quantum-enabled networks, our roadmap leads to a world where quantum technology is scalable, accessible, and commercially available for everyone. A unified photonic platform powers four breakthrough verticals, each translating quantum capabilities into real-world products and practical innovation.
Our four unique verticals are:
Quantum Processing Unit (QPU):
NP-hard problem solver for optimization, simulation & differential equations
Quantum open systems, gate-based machines
Quantum Cyber Module (QCM):
Quantum authentication & encryption, quantum PUF & quantum random number generation
One module. Many utilities. Reconfigured in real time.
Photonic Intelligent Unit (PIU):
Offload computation-intensive tasks to photonics, optical signal processing
Reconfigurable, analog, hybrid, offers native optical processing superior to GPU and DSP
Quantum intelligent Sensing Module (QiSM):
Quantum sensing and data processing onboard
Single photon lidar & vibrometer, quantum-enhanced & noise-resilient sensing and spectroscopy
Key
QPUF: Quantum Physically Unclonable Function
OSP: Optical Signal Processor
QNN: Quantum Neural Network
QRW: Quantum Random Walks
QKD: Quantum Key Distribution
QRNG: Quantum Random Number Generator
QC: Quantum Computer